首页> 外文会议>European Conference on Fracture >MULTI-SCALE ANALYSIS OF MICROSCOPIC STRESS CONCENTRATION AT GRAIN BOUNDARY IN WELD METAL OF NI-BASED ALLOY JOINT FOR SCC EVALUATION
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MULTI-SCALE ANALYSIS OF MICROSCOPIC STRESS CONCENTRATION AT GRAIN BOUNDARY IN WELD METAL OF NI-BASED ALLOY JOINT FOR SCC EVALUATION

机译:Ni基合金接头SCC评估中晶界显微应力集中度的多尺度分析

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An analysis method to calculate the microscopic stress distribution in crystalline grain scale was proposed in order to predict the occurrence of SCC in weld metal of nuclear power plant components. Crystal plasticity theory was incorporated in order to calculate microscopic stress concentration at columnar grain boundary in Ni-based alloy weld metal. SCC tests of Alloy 600 weld metal were performed to identify the location of cracks. Cracks were occurred at grain boundaries. The crystal orientation was measured by electron backscatter pattern (EBSP) method and was introduced into the microscopic model of the multi-scale analysis. The multi-scale analysis was applied to the evaluation of the microscopic stress distribution in the SCC test specimen. Microscopic model that has the actual grain shapes and crystal orientations were generated based on EBSP analysis result. A tensile loading was applied to the model and the microscopic stress distribution was estimated. The stress concentration was occurred at grain boundaries. Stress concentration at grain boundaries was possible to be predicted by the proposed multi-scale analysis and was in good agreement with the experimentally observed cracks.
机译:为了预测核电站部件焊接金属中SCC的发生,提出了一种计算晶粒尺寸微观应力分布的分析方法。为了计算镍基合金焊接金属中柱状晶界处的微观应力集中,采用了晶体可塑性理论。进行了合金600焊缝金属的SCC测试,以确定裂纹的位置。在晶界出现裂纹。晶体取向通过电子背散射图案(EBSP)方法测量,并被引入多尺度分析的微观模型中。将多尺度分析应用于SCC试样中微观应力分布的评估。根据EBSP分析结果,生成了具有实际晶粒形状和晶体取向的微观模型。对模型施加拉伸载荷,并估计微观应力分布。应力集中发生在晶界处。通过提出的多尺度分析可以预测晶界处的应力集中,并且与实验观察到的裂纹高度吻合。

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