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Interfacial Microstructure and Strength of Vacuum Brazed Joints of Ternary Ceramics Ti3SiC2

机译:三元陶瓷TI3SIC2的真空钎焊接头的界面微观结构和强度

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Ti3SiC2 is one of the nano-layered ternary ceramics Mn+1AXn,where M is a transition metal,A is an A-group (mostly ⅢA or ⅣA) element,and X is C or N.With the filler of Ag-Cu-Ti,the brazing of Ti3SiC2 has been conducted at 800°C-950°C for 5-10min under 3.5× 103pa in a vacuum.The phase composition and microstructure of the joints were investigated by XRD,SEM AND EPMA.The diffusion of Cu element in fillers through the reaction zone toward Ti3SiC2 is the main controlling step in the bonding process.Joint strengths were evaluated by three point bending test.The maximum flexural strength of joints reaches is 306±11MPa,which is lower than the bending strength of Ti3SiC2,obtained under the same condition.
机译:Ti3SIC2是纳米层三元陶瓷Mn + 1AxN之一,其中M是过渡金属,a是A组(大多数ⅢA或ⅳA)元素,X是C或N.与Ag-Cu的填充剂Ti,Ti3SIC2的钎焊在800℃-950℃下在真空下在3.5×103Pa下进行5-10mIn。通过XRD,SEM和EPMA研究了关节的相组成和微观结构。Cu的扩散填料中的元素通过反应区朝向Ti3SIC2是粘合过程中的主要控制步骤。通过三点弯曲试验评估了外延强度。接头达到的最大抗弯强度为306±11MPa,低于Ti3sic2的弯曲强度,在相同的条件下获得。

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