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Using rapid chip calorimetry to investigate nano-gram quantities of material

机译:使用快速芯片量热法来研究纳米克数量的材料

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One of the advantages of rapid chip calorimetry is that one can measure the behavior of very small quantities of material in order to investigate the material properties in nano-metric confinement, viz., ultrathin polymer films. In addition, the method can be used to investigate the calorimetric response of materials that are produced with great difficulty and in extremely small quantities, such as samples made by vapor deposition processes. We have been pursuing investigations in both areas. First, we have used the commercial Flash DSC system to investigate the glass transition response of ultrathin polymer films as a function of both cooling rate and film thickness [1]. Of particular interest is that the behavior of polycarbonate shows a strong reduction in the glass transition temperature as the films get thinner, with the magnitude of the reduction being greater for the slowest cooling rates. In addition it is observed that the temperature dependence of the response is also a function of film thickness with both fragility and activation energy decreasing with decreasing film thickness. In the case of materials that are very difficult to make or are made very slowly, we have used a vapor deposition process to create small quantities (30 to 250 ng) of an amorphous fluoropolymer and established that, under the right conditions of deposition, the fictive temperature is approximately 57 oC below the glass transition temperature [2]. By determining the cooling rate dependence of the fictive temperature of the rejuvenated sample we were able to determine the nominal Vogel [3] temperature or Kauzmann [4] temperature TK and find that the vapor deposited glass had a fictive temperature equal to the value of TK. This opens up novel perspectives in examining polymers in the deep glassy state [5] which we are exploring. Finally, the chip calorimeter can also be used to perform very rapid cooling and heating rate experiments, hence offering the opportunity to make glasses from materials that are otherwise difficult to vitrify due to intervening crystallization during ordinary cooling rates typical of conventional DSC. One such material is TNT for which we were able to determine the glass temperature ranges from 247.5 K to 239.3 K over the cooling rate from 1000 K/s to 10 K/s [6]. At slower cooling rates the sample was found to crystallize and no glass transition was observed. In addition, we found that at cooling rates above 100 K/s no cold crystallization was observed when heating at 600 K/s. Of interest in this case is that in working with energetic materials it is often a great benefit to be able to test small quantities of material because of safety concerns. The importance of the results will be discussed.
机译:之一的快速芯片量热法的优点是可以测量非常小的量的材料的行为,以便调查在纳米度量约束的材料特性,即,超薄聚合物薄膜。此外,该方法可用于研究的所产生好容易和在极小量,例如通过气相沉积工艺制备的样品材料的量热响应。我们一直追求在这两个领域的研究。首先,我们已经使用了商用闪存DSC系统,以调查超薄聚合物薄膜既冷却速度和薄膜厚度[1]的函数的玻璃化转变响应。特别感兴趣的是,聚碳酸酯示出了行为强烈降低的玻璃化转变温度作为膜变得更薄,与减速的量大为最慢的冷却速率的幅度。此外,观察到的响应的温度依赖性也膜厚与两个脆性和活化能随膜厚度减小的函数。在的,是非常难以实现或者非常缓慢地制成的材料的情况下,我们已经使用的汽相淀积过程以产生少量的(30〜250毫微克)的无定形含氟聚合物的和沉积,所述的合适的条件下所建立,假想温度低于玻璃化转变温度[2]约57摄氏度。通过确定所述复原样品的假想温度的冷却速度的依赖性,我们能够确定标称沃格尔[3]温度或Kauzmann [4]温度TK,发现气相沉积的玻璃有一个假想温度等于传统知识的价值。这开辟了在其中我们正在探索深玻璃态[5]检查聚合物新颖观点。最后,该芯片量热仪也可以被用于执行非常快速的冷却和加热速率的实验,因此提供机会以从由于在典型的常规DSC的普通冷却速率结晶居间否则难以玻璃化的材料制作眼镜。一种这样的材料是TNT一个我们能够从247.5ķ以上的冷却速度从1000 K至确定玻璃的温度范围,以239.3 K / s到10 K / S [6]。在较慢的冷却速率将样品发现结晶并没有观察到玻璃化转变。此外,我们发现,在冷却高于100钾肥用量/ s的,没有观察到冷结晶在600 K加热时/秒。在这种情况下,有趣的是在用高能材料的工作,常常要能够测试材料的小批量的,因为安全问题大有益处。结果的重要性进行讨论。

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