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An analysis of the cathode thermal conductivity affecting on stability vacuum arc

机译:阴极热导率对稳定真空电弧的影响分析

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This study described the physical mechanism of the thermal conductivity effect on the instability phenomena using the cathode spot model. An analysis of stable arc current is performed by changing thermal conductivity of copper by compound material. It was found that the minimum stability arc is inversely proportion to the thermal conductivity. The thermal conductivity is reduced to increase stable arc current with reducing reversed electron from plasma region. The thermal conductivity is reduced with increasing the stable arc current region. Consequently, the cathode temperature is decreased. It can be concluded that the electron current is reduced by lower cathode temperature. This analysis results revealed that percent weight had inverse variation with thermal conductivity and flow heating alloy. The research results revealed that degree of ionization of copper had inverse variation with arc current. The debye length of copper had direct variation with arc current.
机译:这项研究使用阴极点模型描述了热导率效应对不稳定性现象的物理机制。通过使用复合材料改变铜的热导率来进行稳定电弧电流的分析。已经发现最小稳定性电弧与热导率成反比。降低热导率以增加稳定的电弧电流,同时减少来自等离子体区域的反向电子。随着稳定电弧电流区域的增加,热导率降低。因此,阴极温度降低。可以得出结论,较低的阴极温度会降低电子电流。分析结果表明,重量百分数与导热系数和流动加热合金成反比。研究结果表明,铜的电离度与电弧电流成反比变化。铜的德拜长度随电弧电流而直接变化。

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