Multi-step three dimensional micro assembly for a flexible LED display

摘要

This paper presents a novel multi-step three dimensional microassembly of passive-circuit-mesh, conductive beads, and LED chips to fabricate a flexible, bright, and wide viewing angle display. A novel flexible display architecture is proposed. To deliver this design, we focus our efforts on the multi-batch assembly integration. A 3-by-3 light-emitting diode array with a chip size of 610 ¿m by 610 ¿m by 90 ¿m is successfully prototyped with device fill factor up to 37.97%. It yields a 990 ¿m squared monochromatic pixel.