Chip-to-chip optical wireless link feasibility using optical phased arrays on silicon-on-insulator

摘要

One- and two-dimensional integrated optical phased arrays (OPAs) on silicon-on-insulator have been fabricated and measured having directivities of more than 40dBi and steering ranges up to 10°. These OPAs would allow data rates of 100Mbps at distances up to 0.5m.