TEXTURE OF RAPIDLY SOLIDIFIED CU THIN FILMS STUDIED BY SEM EBSD AND TEM

摘要

We have used transmission electron microscopy (TEM) and scanning electron microscopy (SEM) to analyze the microstructure in polycrystalline 220nm thick copper thin film after laser melting and rapid lateral solidification. The microstructure consisted predominantly of directionally solidified grains up to 22 μm long and about 1 μm wide. We identify four solidification zones, corresponding to occlusion, columnar growth, defective growth, and nucleation. A <100> preferred orientation in the vicinity of the average growth direction in the columnar growth zone has been identified.