Material removal rate based on edge effects in ultra precision polishing process

摘要

Based on the edge effects in the ultra precision polishing process, a revised skin model is used to predict material removal rate (MRR) of circular wafer. With force equation and torque equation, in order to calculate the skin width and the pressure distribution, a revised formula is given. According to Preston's equation, by using Math-Cad software, the material removal rate (MRR) of circular wafer is simulated, and two factors which influence MRR are discussed.One is the distance between the circular wafer center and the polishing tool center; the other is the ratio of the angular velocity of circular wafer to the polishing tool angular velocity.