首页> 外文会议>第五届先进材料与加工国际会议(Fifth International Conference on Advanced Materials and Processing ICAMP-5)论文集 >HOT WORKABILITY DURING SUBTRANSUS DEFORMATION AT HIGHER STRAIN RATES OF TC11 ALLOY WITH WIDMANSTATTEN MICROSTRUCTURE
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HOT WORKABILITY DURING SUBTRANSUS DEFORMATION AT HIGHER STRAIN RATES OF TC11 ALLOY WITH WIDMANSTATTEN MICROSTRUCTURE

机译:Widmanstatten微观结构的TC11合金在较高应变率下在SUBSUBRANSUS变形期间的热加工性

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The effect of processing parameters on hot workability and microstructure evolution during subtransus deformation of TC11 alloy with widmanstaten microstructure was studied using isothermal compression tests. Testing was conducted at strain rates of 0.1-10s-1, temperature ranges 920-980°C and height reductions of 30-70%. The influence of hot working parameters on flow behavior, hot workability and microstructure evolution was systemically investigated. The results showed that all the flow curves exhibited a peak stress at very low strains (<0.1) followed by extensive flow softening. Surface fracture, cavitations and localized shear flow were found to be main factors that limited the hot workability of TC11 alloy. At low strains, lamellar kinking started to occur due to the orientation between the colony α lamellar and stress axis. With deformation continues, reorientation of the lamellar colony occurred and the deformed lamellar became elongated and thinner. At high stains, segmentation and globularization of α lamellar took place to produce a refined microstructure with a grain size around 1μm that is technologically desirable for secondary processes such as supcrplastic forming. A microstructure mechanism map based on the previous results was then established and applied to process design considering defect and microstructure control.
机译:利用等温压缩试验研究了工艺参数对具有魏德曼斯坦微结构的TC11合金亚转变形变形过程中热加工性和组织演变的影响。测试以0.1-10s-1的应变速率,920-980°C的温度范围和30-70%的高度降低进行。系统地研究了热加工参数对流动行为,热加工性能和微观组织演变的影响。结果表明,所有的流动曲线在非常低的应变(<0.1)下都表现出峰值应力,随后发生了广泛的流动软化。发现表面断裂,空化和局部剪切流是限制TC11合金热加工性的主要因素。在低应变下,由于菌落α层状体和应力轴之间的方向,开始出现层状扭结。随着变形的继续,发生了层状菌落的重新定向,并且变形的层状变得拉长和变薄。在高污点下,发生了α层状薄片的分割和球状化,以产生晶粒尺寸约为1μm的细化微结构,这对于二次加工(例如超塑性成形)在技术上是理想的。然后基于先前的结果建立了微结构机理图,并将其应用于考虑缺陷和微结构控制的工艺设计。

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