Study of electromagnetic interference analysis and solution for PoP packaging

摘要

High density package have developed rapidly in a few years, and let electronic device get into Microminiaturization Age. PoP packaging is just an example. It achieves high density by stacking packages but also brings some electrical problems. In this study, electromagnetic interference (EMI) effect of PoP packaging is presented. Three topics are proposed for PoP packaging application. First, two stacked substrates are performed with FR4 dielectric in 8×4mm size. By using different type of transmission line, the effects of EMI are discussed. Second, focusing on incomplete shape ground planes cause return path discontinuous and bring EMI problems. Last, plating through hold (PTH) is applied to reduce EMI effect. We hope to find out some solutions improving EMI for PoP packaging application.