The electroplating behavior of nanocrystalline CoNiFe soft magnetic thin film with high saturation magnetic flux density and low coercivity was investigated using cyclic voltammetry and chronoamperometry methods in conjunction with the scanning electron microscopy (SEM/EDX) and X-ray diffraction (XRD) techniques. The results show that, the co-deposition of CoNiFe alloy behaves anomalously. And the nucleation/growth process of CoNiFe ternary alloy followed 3D instantaneous mechanism at higher potentials, while in the case of lower potentials it followed 3D progressive mechanism.
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