Isocyanurate Trimer Employing Soy Polyol for High Strength, Thermal Stability, and Reduced Density in Composites and Cast Elastomers

摘要

In place of polyester polyol and high temperature processing, MCPU used soy polyol and ambient temperature processing to produce rigid thermosets with chemical and thermal stability. In MCPU's research, the polyol was reacted with an MDI prepolymer to duplicate strong carbon bonds found in conventional trimers, enabling the bio-content polymer to retain dimensional stability when heated to 375 ZF for extended time (8-12 weeks). The low viscosity system (600 cPs @ 77F) generates exotherm capable of driving the reaction to completion without an additional heat source or use of toxic curing agents. Only the molds were heated to 140ZF, a common practice to minimize surface defects. The system gels in 45 seconds and demolds in 60 seconds. Heat-aged samples of were subjected to physical and electrical property testing confirming high strength-to-weight ratio with a hardness ＞70 Shore D, tensile strength and modulus at ＞6,500 and ＞195,000 psi (at 77 ZF). Third party laboratories confirmed dielectric strength at ＞760 V/mil and dielectric constant at 3.45, confirming the polymer's capability for use electrical applications. At 1.15gm/ cm3 density MCP-3335 is approximately 30% lower in weight than epoxies with comparable properties and presents an opportunity to reduce part weight without sacrificing physical strength and temperature resistance.