3-D optical interconnect Mesh network for on-board parallel multiprocessor system based on EOPCB

摘要

A three-dimensional (3-D) 4 × 4 × 4 optical interconnect Mesh network scheme for parallel multiprocessor system based on polymer light waveguide electro-optical printed circuit board(EOPCB) is proposed in this paper. The Mesh topological structures of light waveguide interconnects for processor element chip-to-chip on a board, and board-to-board on backplane is constructed. The system consists of 64 processor element chips interconnected in a 3-D Mesh network configuration. Every processor board comprises 4 × 4 processor element chips with Mesh interconnection. Board-to-board Mesh interconnects are established on a backplane through light waveguide Mesh interconnect topological structure. An additional optical layer with light waveguide structure is used in conventional PCB to construct EOPCB. Vertical cavity surface emitting laser (VCSEL) array is used as optical transmitter array. PEN photodiode array is used as optical receiver array. A MT-compatible direct coupling method is presented to couple light beam between optical transmitter/receiver with light waveguide layer. The optical signals from a processor element chip on a board can transmit to another processor element chip on another board through light waveguide interconnection in the backplane. So 3-D optical interconnection Mesh network for parallel multiprocessor system can be reailzed by EOPCB.