New 1200 V SPT+ Chip Technology and 17 mm IGBT Power Module Platform - The Ideal Combination for State-of-the-Art Inverter Design

摘要

SEMIKRON introduces the next generation of the SoftPunch-Through IGBT, the SPT+, in it's flat 17 mm SEMiX power module packages as a future platform for the important 1200V market. The new modules show lower switching as well as conduction losses in comparison with the previous SPT chip generation. A self clamping mode of the chip in combination with the innovative SEMiX package allow for an easy, cost effective and compact inverter design. This article shows results of tests on the electrical behaviour and comparisons with the previous chip generation.