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Experimental Study of Porous Silicon Thermal Conductivity Using Micro-Raman Spectroscopy

机译:显微拉曼光谱法研究多孔硅的导热系数

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Recently, PS has become a new thermal insulating material in MEMS due to its excellent thermal properties. Compared with traditional thermal isolation methods such as thin Si structure (membranes or cantilever beams) or materials with low thermal conductivity values (quart, polymer films, etc.), PS have a lot of advantages. With the research of PS as thermal isolation materials, the investigation of its thermal conductivity (TC) also attracts people's attention. There are many measurement methods for thermal conductivity such as photoacoustic technique, Micro-Raman technique; Optical pump-probe method et al. Micro-Raman technique was introduced for its simple and nondestructive method of measuring TC. In this paper, the TC of porous silicon with different porosity and thickness prepared by electrochemical method was measured by Micro-Raman technique. The TC values we got is 0.624 W/M·K (thickness 110 μm and porosity 65%). This extremely low TC value reflects a reduced thermal transport in PS. From the research of experiment result, we could see that there is a linear relationship between the Raman peak position and temperature of porous silicon. The TC of porous silicon will decrease rapidly with increasing porosity and thickness. When thickness and porosity increased from 9 μm and 40% to 110 μm and 65%, the TC decreases from 25.32 W/M·K to 0.624 W/M·K. Finally, this trend was discussed in detail.
机译:近来,PS由于其优异的热性能而已成为MEMS中的新型绝热材料。与传统的热隔离方法(例如薄Si结构(膜或悬臂梁)或导热系数低的材料(石英,聚合物薄膜等))相比,PS具有许多优势。随着PS作为绝热材料的研究,对其导热系数(TC)的研究也引起了人们的关注。测量热导率的方法有很多,例如光声技术,Micro-Raman技术;光学泵浦探针法等。引入微拉曼技术是因为它具有简单而无损的TC测量方法。用Micro-Raman技术测量了电化学法制备的不同孔隙率和厚度的多孔硅的TC。我们获得的TC值为0.624 W / M·K(厚度110μm,孔隙率65%)。极低的TC值反映了PS中传热的减少。从实验结果的研究中,我们可以看到拉曼峰的位置与多孔硅的温度之间存在线性关系。多孔硅的TC将随着孔隙率和厚度的增加而迅速降低。当厚度和孔隙率从9μm和40%增加到110μm和65%时,TC从25.32 W / M·K降低到0.624 W / M·K。最后,对该趋势进行了详细讨论。

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