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MODIFICATION OF AMORPHOUS AND MICROCRYSTALLINE SILICON FILM PROPERTIESAFTER IRRADIATION WITH MEV AND GEV PROTONS

机译:MEV和GEV质子辐照后对非晶态和微晶硅膜性质的修饰

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Intrinsic and differently doped amorphous and microcrystalline silicon thin films have been exposed toproton beams at two different energies in the lower MeV and in the GeV range. In order to check for the relationbetween the radiation hardness and film crystallinity, the films have been characterized before irradiation by Ramanmeasurements and the influence of the irradiation on the temperature dependence of the dark conductivity has beeninvestigated.We found even at an extremely high proton beam energy of 24GeV a degradation of all thin siliconfilms. The degradation is more pronounced for microcrystalline films than for amorphous films. For dopedmicrocrystalline films we observe for 24 GeV, 5 .1013 p/cm2 as well as for 1.7 MeV, 5.1012 p/cm2 proton irradiationroughly a doubling of the dark conductivity activation energy and a decrease of the dark conductivity. For intrinsicamorphous films, proton irradiation at both energies results in a decrease of the activation energy and an increase ofthe dark conductivity.
机译:本征和不同掺杂的非晶硅和微晶硅薄膜已经暴露于 较低的MeV和GeV范围内的两种不同能量的质子束。为了检查关系 在辐射硬度和薄膜结晶度之间,已在拉曼辐射之前对薄膜进行了表征 测量和辐照对暗电导率的温度依赖性的影响 我们发现即使在24GeV的极高质子束能量下,所有薄硅的降解 电影。微晶膜的降解比非晶膜的降解更为明显。对于掺杂 我们观察到的24 GeV,5 .1013 p / cm2以及1.7 MeV,5.1012 p / cm2质子辐照的微晶膜 暗电导率活化能大约增加一倍,暗电导率降低。对于内在 非晶质膜,质子在两种能量下的照射都会导致活化能的降低和金属离子的增加。 暗电导率。

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