Finite Element Analysis of Nano/Micro Pattern Fabrication by Nanoscratch Process

摘要

The effect of nanoscratch experimental parameters (scratch velocity, normal load, and tip radius) on the deformation behaviors of hard-brittle materials (amorphous silicon, Pyrex 7740 glass), such as piling-up (or sinking-in), elastic recovery, and residual stress field, were studied with the finite element method. For a given applied normal load, elastic recovery increased with the tip radius due to the increase of the elastic contact area. The amorphous silicon showed a lower elastic recovery than the Pyrex 7740 glass due to the larger value of the elastic modulus compared with that of the plastic strength (E/σ_y). In addition, the elastic recovery of the Pyrex 7740 glass decreased with decreasing scratch velocity.