Effect of Different Modes of Contact on Material Removal Rate and Non-Uniformity in Abrasive-Free CMP Process

摘要

Modes of contacts during Cu-CMP using abrasive free slurries were studied. Material remvoval rate and Within Wafer Non-uniformity (WIWNU) versus relative velocity gave three significant contact regimes. Prestonian phenomena in MRR were found in solid-solid contact regime. Non-prestonian phenomena were found in mixed and hydroplaning regime, but at higher pressure, MRR again followed prestonian phenomena. Higher MRR and good WIWNU were found in mixed contact mode but close to solid-solid contact regime.