首页> 外文会议>AESF SUR/FIN annual international technical conference >Synergistic Effects of Copper Plating Additives Filter Type for Coil Plating in Write Heads
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Synergistic Effects of Copper Plating Additives Filter Type for Coil Plating in Write Heads

机译:写入头中铜镀覆添加剂和过滤器类型对线圈镀覆的协同效应

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The coils in write heads for disk drives are made of electroplated copper. These can beplated from acid copper baths with proprietary additives. Recently, plating studies done fordamascene copper interconnects have shed light on specific chemicals used in copper platingadditives. A Hull cell study of three copper additives has been done to assess their applicabilityfor plating copper coils. The three additives studied were polyethylene glycol, Janus Green Band 3-mercapto-propane-sulfonic acid. These coils were also plated in the same acid copper bathin presence of a proprietary additive. A large offset was found between the test sites and the coilsplated thickness. This phenomenon was related to polyethersulfone filter and was reduced bychanging the filter to the inert polypropylene one. An attempt is made to explain thesephenomena.
机译:磁盘驱动器写头中的线圈由电镀铜制成。这些可以是 从酸性铜浴中镀上专有添加剂。最近,电镀研究完成了 镶嵌铜互连已经阐明了镀铜中使用的特定化学物质 添加剂。已对三种铜添加剂进行了赫尔电池研究,以评估其适用性 用于镀铜线圈。研究的三种添加剂是聚乙二醇,Janus Green B 和3-巯基丙烷磺酸。这些线圈也镀在相同的酸性铜浴中 在专有添加剂的存在下。在测试位置和线圈之间发现较大的偏移量 镀层厚度。这种现象与聚醚砜过滤器有关,并通过减少 将过滤器改为惰性聚丙烯。试图解释这些 现象。

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