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A Cohesive-Zone-Model Based Fracture Criterion for Silicon Microstructures with Sharp Notches

机译:基于内聚区模型的具有尖刻痕的硅微结构断裂准则

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Anisotropically etched silicon microstructures may contain atomically sharp notches, which quite often become the origin of mechanical failure. For sharp notches a relation between the notch stress intensity factor and the microscopic surface separation energy similar to the one for classical crack problems, does not exist. A general fracture criterion independent of notch angle has been sought in the literature. In this study, by postulating the existence of a cohesive zone in front of the notch tip and using a simple Barenblatt cohesive zone model, a relation between the critical macroscopic notch stress intensity factor and material's microscopic separation energy is derived. Being different to the relation for classical crack problems, this general relation is also a function of material's cohesive strength. The criterion has been applied to silicon microstructures with sharp notches, where experimental results are available.
机译:各向异性蚀刻的硅微结构可能包含原子尖锐的缺口,这些缺口经常成为机械故障的根源。对于尖锐的缺口,缺口应力强度因子与微观表面分离能之间的关系不类似于经典裂纹问题。在文献中已经寻求了与切口角无关的一般断裂准则。在这项研究中,通过假设缺口尖端前面存在一个粘结区域并使用简单的Barenblatt粘结区域模型,得出了临界宏观缺口应力强度因子与材料的微观分离能之间的关系。与经典裂纹问题的关系不同,该一般关系也是材料内聚强度的函数。该标准已应用于具有尖锐缺口的硅微结构,那里有实验结果。

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