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Investigation of Defects and Polarity in GaN Using Hot Wet Etching, Atomic Force and Transmission Electron Microscopy and Convergent Beam Electron Diffraction

机译:利用热湿蚀刻,原子力和透射电子显微镜以及会聚束电子衍射研究GaN中的缺陷和极性

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Availability of reliable and quick methods to investigate defects and polarity in GaN films is of great interest. We have used photo-electrochemical (PEC) and hot wet etching to determine the defect density. We found the density of whiskers formed by the PEC process to be similar to the density of hexagonal pits formed by wet etching and to the dislocation density obtained by transmission electron microscopy (TEM). Hot wet etching was used also to investigate the polarity of MBE-grown GaN films together with convergent beam electron diffraction (CBED) and atomic force microscopy (AFM). We have found that hot H_3PO_4 etches N-polarity GaN films very quickly resulting in the complete removal or a drastic change of surface morphology. On the contrary, the acid attacks only the defect sites in Ga-polar films leaving the defect-free GaN intact and the morphology unchanged. The polarity assignments, confirmed by CBED experiments, were related to the as-grown surface morphology and to the growth conditions.
机译:可靠且快速的方法可用于研究GaN膜中的缺陷和极性,这一点引起了极大的兴趣。我们已经使用光电化学(PEC)和热湿蚀刻来确定缺陷密度。我们发现,通过PEC工艺形成的晶须密度与通过湿法蚀刻形成的六边形凹坑密度以及通过透射电子显微镜(TEM)获得的位错密度相似。还使用热湿蚀刻来研究MBE生长的GaN膜的极性以及会聚束电子衍射(CBED)和原子力显微镜(AFM)。我们发现,热的H_3PO_4非常快速地蚀刻N极性GaN膜,从而导致表面形态被完全去除或急剧变化。相反,酸仅腐蚀Ga极性膜中的缺陷部位,而使无缺陷的GaN完好无损,并且形态不变。通过CBED实验确认的极性分配与生长的表面形态和生长条件有关。

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