New adhesives based on cationic polymerization-- a system solution for applications in microelectronics

摘要

In recent years, the number of applications in electronics, where adhesives, sealants and coating compounds are used, hassignificantly increased. At the same time, with the number of applications, the number of adhesives used for this purpose rosealso. Thus, generally there is a suitable adhesive for each application. However, the necessity to sometimes use severaladhesives together often results in unwelcome reciprocal interactions, which may severely change the normally goodproperties of an adhesive.Therefore, the goal of the adhesive manufacturer must be to offer system solutions. A series of very different materials, suchas Die-Attach adhesives, electrically conductive adhesives, Glob-Tops, etc., which do not reciprocally interact but still fulfilthe different requirements of the user, are in demand.Since the beginning of the nineties, light-curing epoxy resins have conquered and firmly established a place in the adhesivesector and as coating and sealing compounds, because of their extremely short curing times. Sofar, however, it was notpossible to use the advantages of these cationic-curing adhesives for applications where light-curing could not be applied. Bydeveloping heat-curing cationic systems, it is now possible to offer adhesives enabling dual-curing as well as solely heatcuring.These adhesives can be combined, as you like, because a reciprocal interaction is impossible.