首页> 外文会议>Electrochemical Technology Applications in Electronics >ELECTRODEPOSITION OF GOLD FROM A SULPHITE BATH BY DIRECT AND PULSE CURRENTS: APPLICATIONS TO OPTO-ELECTRONIC DEVICES
【24h】

ELECTRODEPOSITION OF GOLD FROM A SULPHITE BATH BY DIRECT AND PULSE CURRENTS: APPLICATIONS TO OPTO-ELECTRONIC DEVICES

机译:直接和脉冲电流从亚硫酸盐浴中电解沉积金:在光电设备中的应用

获取原文

摘要

The applicability of gold electrodeposition from a sulphite electrolyte for the manufacture of opto-electronic devices has been investigated. Electrodeposition of gold has been carried out by direct and pulse currents at a rotating cylinder Hull type cell and a rectangular flow cell. The rotating cylinder Hull cell was used to determine the effect of fluid hydrodynamics, current density, and current waveform on the microstructure of gold deposits in the laboratory. Electrochemical and hydrodynamic parameters that yielded best results in laboratory experiments were then used to electrodeposit gold on wafers placed in a rectangular flow cell. It was found that the microstructure of gold was dependent on applied current density during direct current deposition, but it was dependent on steady state and non-steady state mass transfer during pulse current plating.
机译:研究了亚硫酸盐电解质中金电沉积在制造光电器件中的适用性。金的电沉积已经通过直流和脉冲电流在旋转圆柱体的Hull型电解槽和矩形流通池中进行。旋转圆柱体赫尔槽用于确定流体流体动力学,电流密度和电流波形对实验室中金矿的微观结构的影响。然后,将在实验室实验中获得最佳结果的电化学和流体动力学参数用于将金电沉积在放置在矩形流通池中的晶圆上。发现金的微观结构取决于在直流沉积期间施加的电流密度,但是取决于脉冲电流镀覆期间的稳态和非稳态传质。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号