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High speed stencil printing of solder paste a DOE full factorial experiment

机译：高速模版印刷焊膏膏母鹿全部造成实验

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This paper is aimed at presenting the results of a full factorial DOE on High Speed Stencil Printing of Solder Paste. The experiment was funded by the TRW Foundation and was conducted at RIT's Center for Electronics Manufacturing.

机译：本文旨在展示焊膏高速模版印刷的完整因子。该实验由TRW基金会资助，并在Rit的电子制造中心进行。

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《SMTA international conference》|2000年||共4页
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Prof.S.Manian Ramkumar; Jason Lemery;
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中图分类半导体技术;
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3. Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process [J] . Srinivasa Aravamudhan, Daryl Santos, Gerald Pham-Van-Diep, Journal of Electronic Packaging . 2005,第3期

机译：模版印刷过程中小模版孔中焊膏释放的特征
4. High speed stencil printing of solder paste a DOE full factorial experiment [C] . Prof.S.Manian Ramkumar, Jason Lemery SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000 . 2000

机译：锡膏的高速模版印刷DOE全因子实验
5. Stencil Printing Optimization to Control Solder Paste Volume Transfer Efficiency [D] . Khader, Nourma. 2018

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7. Optimization Of Solder Paste Printing Parameters Using Design Of Experiments (DOE) [O] . Sekharan Gopal, Mohd. Rohani Jafri, Mohd. Yusof Shari, 2005

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High speed stencil printing of solder paste a DOE full factorial experiment

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