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Optical backplanes utilizing multimode polymer waveguides

机译:利用多模聚合物波导的光学背板

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Optical inks are expected to overcome the imitiations imposed byelectrical links even for short transmission distances as they have done in telecommunications trunk networks. For board-to-borard and board-to-multiboard communication we have developed an opgical backplane for applications in mobile systems. Compared to fiber based realizations it is complact, rugged and has the potential to be fabricated at low cost. the main features of the optical backplane in planar technology are free space expanded beam transmission between boards and backplane and guided wave transmission within the backplane. No optical connectors are required. Due to the expanded beams and highly multimode waveguides large coupling tolerances of several 100 mu m are achieved. Low loss polymer backplane waveguides (3dB/m) allow transmission lengths of more than 19". Demonstrators for board-to-board interconnections and star networks have been resulized. Thransmission experiments at 1GBit/s have been sucessfully peformed. Environmental tests porve the thermal stability of the polymer waveguides.
机译:像在电信干线网络中所做的那样,即使对于短的传输距离,光学油墨也有望克服电气链路的影响。对于板对板和板对多板通信,我们为移动系统中的应用开发了一种光学背板。与基于光纤的实现相比,它更为紧凑,坚固耐用,并且具有以低成本制造的潜力。平面技术中光学背板的主要特征是板与背板之间的自由空间扩展光束传输以及背板内的导波传输。不需要光连接器。由于光束的扩展和高度多模的波导,实现了几百微米的大耦合公差。低损耗聚合物背板波导(3dB / m)允许传输长度超过19英寸。板对板互连和星形网络的演示器已经过重新研制。成功进行了1GBit / s的发射试验。聚合物波导的稳定性。

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