A 256 channel Bi-directional optical interconnect using VCSELs and photodiodes on CMOS

摘要

Two-dimensional parallel Optical Interconnects (2D-POIs) are capable of providing large connectivity between elements in computing and sitching systems. Using this tchnology we have demonstrated a bi-directional optical interconnect between two PCBs containing optoelectronic VLSiI circuits. The OE-VLSI circuits were constructed using VCSELs and photodiodes flip-chip bump bonded to a 0.35 mu m CMOS chip. The CMOS was comprised of 256 Vertical Cavity Surface Emitting Laser (VCSEL) drivers, 256 receivers, and the requisite buffer and control circuits required to operate the large transceiver array. This is the first system, to our knowledge, to send bi-directional data optically between optoelectronic VLSI chips which have both VCSELs and photodiodes co-integrated on the same substrate.