1.7 Volt, Dc to 15 Ghz Differential Amplifier Module

摘要

A high performance packaging approach for state-of-the-art high frequency ICs has been adopted by creating fully planar carrier-interconnect surfaces for the embedded chip(s) on the substrate. the structure is most suitable for several 10's of Gb/s in ICs for fiber optical communication and microwave and millimeter wave wireless systems. 1.7 volt, DC to 15GHz differential amplifier module [1] has been designed and studied to demonstrate the techniques being developed.