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Fujitsu/Sun Microsystems Ultrasparc-IIi MCM: Miniaturization to the Extreme

机译:富士通/ Sun Microsystems Ultrasparc-IIi MCM:小型化到极限

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Fujitsu and Sun Microsystems have developed an UltraSparcIIi processor MCM for embedded network applications. This MCM combines Sun Microsystems 300MHz UltraSparcIIi RISC processor sillicon technology with Fujitsu's packaging technology for processor based MCMs. This new embedded processor-based network module is an integration of UltrasparcIIi's DRAM controller and PCI interface, L2 cache, and discrete devices in a powerful module that measures just 45 mmx45mm, 75
机译:富士通和Sun Microsystems已经为嵌入式网络应用开发了UltraSparcIIi处理器MCM。该MCM结合了Sun Microsystems 300MHz UltraSparcIIi RISC处理器硅技术和富士通针对基于处理器的MCM的封装技术。这种新的基于嵌入式处理器的网络模块是UltrasparcIIi的DRAM控制器和PCI接口,L2缓存以及分立设备的集成,其功能强大,仅占45mmx45mm,75

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