Development of surface Attached Passive Devices on Flexible Films

机译：柔性薄膜表面附着无源器件的开发

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A new and effective method of incorporating passive devices onto Printed Wiring Board (PWB) substrates was investigated. The technology makes use of integral thin film resistors and capacitors fabricated on a flexible polyimide film. The passive devices are fabricated onto discrete Surface Attached Passive (SAP) films. The SAP films are then solder bumped as patched to the surface of a PWB. These SAP patches are designed to be mounted to the PWB under leaded IC packages.

机译：研究了一种将无源器件结合到印刷线路板（PWB）基板上的新的有效方法。该技术利用在柔性聚酰亚胺薄膜上制造的整体薄膜电阻器和电容器。无源器件被制造在离散的表面附着无源（SAP）膜上。然后将SAP薄膜焊成凸点，使其贴在PWB的表面上。这些SAP修补程序设计为使用含铅IC封装安装到PWB。

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《Annual Pan Pacific microelectronics symposium》|1999年|p.240-246|共7页
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作者
Bret Dahl; Gabriel Morcan; Tenyu Thach; Simon Ang; Leonard Schaper;
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原文格式 PDF
正文语种
中图分类无线电电子学、电信技术;
关键词
Passives, Thin-films, Surface-Attach, Resistor, Capacitor;

机译：无源，薄膜，表面贴装，电阻器，电容器;

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4. Development of surface Attached Passive Devices on Flexible Films [C] . Bret Dahl, Gabriel Morcan, Tenyu Thach, Annual Pan Pacific microelectronics symposium . 1999

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Development of surface Attached Passive Devices on Flexible Films

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