首页> 外文会议>Conference Proceedings at ANTEC '98 >MEASUREMENT OF THERMAL CONDUCTIVITY USING TEMPERATURE-MODULATED DIFFERENTIAL SCANNING CALORIMETRY: SOLUTION TO THE HEAT FLOW PROBLEM
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MEASUREMENT OF THERMAL CONDUCTIVITY USING TEMPERATURE-MODULATED DIFFERENTIAL SCANNING CALORIMETRY: SOLUTION TO THE HEAT FLOW PROBLEM

机译:使用温度调制的差示扫描量热法测量热导率:热流问题的解决方案

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The dependence of the apparent heat capacity obtained from quasi-isothermal temperature-modulated differential scanning calorimetry (TMDSC) experiments and the thermal conductivity is determined for several cases. The relationships are based on the solution of the heat conduction equation which gives the temperature profile in the TMDSC sample. The temperature profile is then used to calculated the sinusoidal heat flow to the sample. We compare our results with those of other researchers. We also show the effect of thermal resistance on the results.
机译:在几种情况下,确定了通过准等温温度调制差示扫描量热法(TMDSC)实验获得的表观热容量与热导率的相关性。这些关系基于热传导方程的解,该方程给出了TMDSC样品中的温度曲线。然后将温度曲线用于计算流向样品的正弦热流。我们将我们的结果与其他研究人员的结果进行比较。我们还显示了热阻对结果的影响。

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