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Effect of silicon addition on the oxidation mechanism of Cu-6.7percent al sintered but hot forged alloys in air

机译:添加硅对Cu-6.7%Al烧结但热锻合金在空气中氧化机理的影响

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Experiments have been carried out to establish the oxidation mechanism/s of sintered but hot forged Cu-6.7percentAl alloys in air with or without the addition of silicon (0.0, 1.0 & 2.0percent) at the temperatures 523, 623 & 723 K. Analysis of the experimental data has revelated semi-logarithmic rate equation at all temperatures of oxidation for Cu-6.7;ercent Al - 2.0percent Si alloy. The rate equation conformed to the form; Wg = K_1log_(10)(K_2t+K_3) where, Wg=weight gain at time, t and K_1,K_2 & K_3 are empirically determined constants. However, the oxidation mechanism at all temperatures of oxidation for Cu-6.7percentAl and Cu-6.7percentAl-1.0percentSi followed semi-logarithmic rate equation and altered only after a certain time of oxidation even though the mechanism remained represented by the similar rate equation. The overall analysis has shown that the Cu-6.7percentAl-2.0percentSi alloy can be safely used in the air environment at an elevated temperature range between 523 and 723 K due to its highly protective,adherent and impermeable oxide layer.
机译:已经进行了实验,以建立在523、623和723 K的温度下在有或没有添加硅(0.0%,1.0%和2.0%)的情况下,烧结但热锻的Cu-6.7%Al合金在空气中的氧化机理。分析的实验数据揭示了在所有氧化温度下,Cu-6.7; Al-2.0%Si合金的半对数速率方程。速率方程符合以下形式: Wg = K_1log_(10)(K_2t + K_3)其中,Wg =在时间的重量增加,t和K_1,K_2和K_3是根据经验确定的常数。但是,Cu-6.7%Al和Cu-6.7%Al-1.0%Si在所有氧化温度下的氧化机理遵循半对数速率方程,并且仅在氧化一定时间后才发生改变,即使该机理仍然由相似的速率方程表示。总体分析表明,由于Cu-6.7%Al-2.0%Si合金具有高度保护性,粘附性和不渗透性,因此可以在523至723 K的高温范围内在空气环境中安全使用。

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