Numerical modelling of resin cure using a general purpose FE package

摘要

This paper proposes a procedure for using a general purpose finite element package with a transient thermal analysis facility to perform cure modelling. In the procedure, a general purpose finite element package was employed to carry out transient thermal analysis and a user program was developed to simulate the cure kinetics using nodal control volumes based on the finite element mesh. Theoretical background and numerical implementation of the procedure are described in the paper.