【24h】

Rules vs tools

机译:规则和工具

获取原文

摘要

On behalf of the organizing committee for the 2007 International Symposium on Physical Design (ISPD), we would like to extend a warm welcome. This is the 11th year of ISPD; from rather humble beginnings as the ACM/SIGDA Physical Design Workshops held intermittently during 1987-1996, the event has evolved into the most competitive forum for the research area. The research community for physical design is not big, but the problems addressed are large. Over the years, many groundbreaking ideas have appeared first at ISPD. The recent interest in benchmarking and open competitions also has roots in ISPD. >In earlier years, the perception outside our community was that physical design was simply the shuffling of rectangles to create masks. While the placement of rectangles is certainly a part of our work, modern physical design is much more complex and penetrating. Variability introduced by manufacturing, interconnect delay, and heat dissipation are all tied to the physical layout of a circuit. The papers included in these proceedings reveal many aspects of the physical design problem; as technology marches forwards, physical design tools will have to deal with more and more complex issues. >This year's call for papers attracted over 65 submissions of which 22 were accepted. The focus of ISPD attracts only papers that are on topic, so the accepted papers represent the best of the best. In addition to the technical presentations, we have keynote and invited talks that should be of broad interest. We are particularly pleased to have a keynote from IBM's Jim Kahle, Chief Architect of the Cell processor. The general consensus of the VLSI community is that further performance increases from clock scaling are unlikely; power delivery and heat removal are simply too expensive. Parallel computation appears to be the only economical way to improve performance, and the Cell processor is helping to lead the way. The symposium also features a panel discussion by leading experts on"Rules vs. Tools -- What's the right way to address IC manufacturing complexity?" for 45nm and below. It also features special sessions and invited talks on statistical/physical design for manufacturability and the future interconnects. >In the prior two years, ISPD has held a placement contest, featuring large benchmarks derived from industrial designs. There are at least a dozen groups around the world who are actively working on placement; this year, the newest results for these benchmarks will be posted. >A new contest for global routing is being introduced this year; like the placement contest, we expect a large turnout and fierce competition. The goal of both the placement and routing contests is to set clear objectives for research, and to be able to accurately compare different approaches. While perhaps not as widely known as World Cup Soccer, those involved are just as passionate. >The papers from the symposium are available on the ACM Digital Library; slides from most talks for this and prior years are available on the ISPD web site: http://www.ispd.cc.
机译:代表 2007国际物理设计国际研讨会(ISPD)的组委会(ISPD),我们想延长热烈欢迎。这是ISPD的11 TH 从相当谦逊的开始作为ACM / SIGDA物理设计研讨会在1987-1996期间间歇性地举行,该活动已经发展成为研究区最竞争力的论坛。物理设计的研究界并不大,但解决的问题很大。多年来,许多突破性的想法首先出现在ISPD。最近对基准和开放竞争的兴趣也在ISPD中的根源。 >在早些时候,我们社区之外的感知是物理设计只是矩形的洗牌,以创造面具。虽然矩形的放置肯定是我们工作的一部分,但现代物理设计更复杂和渗透。通过制造,互连延迟和散热引入的可变性与电路的物理布局完全相关。这些程序中包含的论文揭示了物理设计问题的许多方面;随着技术前进的,物理设计工具必须处理越来越复杂的问题。 >今年的论文的呼吁吸引了65份提交的,其中22次被接受。 ISPD的焦点只吸引了主题的论文,所以接受的论文代表了最好的论文。除了技术演示文稿外,我们还有主题演讲和邀请的谈判,应该具有广泛的兴趣。我们特别高兴地拥有电池处理器的首席架构师IBM的Jim Kahle主题演讲。 VLSI社区的一般共识是,进一步的性能从时钟缩放增加不太可能;电源输送和散热太昂贵。并行计算似乎是提高性能的唯一经济方式,并且细胞处理器有助于引导方式。该研讨会还通过“规则与工具”的领先专家提供小组讨论 - 解决IC制造复杂性的正确方法是什么?“ 45nm和以下。它还具有特殊会议,并邀请有关可制造性和未来互连的统计/物理设计的谈判。 >在经过两年的时间内,ISPD举办了一个展示比赛,具有来自工业设计的大型基准。世界各地至少有十几个群体积极致力于安置;今年,将发布这些基准的最新成果。 >今年正在介绍全球路由的新比赛;像放置比赛一样,我们预计大型投票率和激烈的竞争。安置和路由竞赛的目标是为研究确定明确的目标,并能够准确地比较不同的方法。虽然可能没有被广泛称为世界杯足球,但那些所涉及的人就像热情一样。 >在ACM数字图书馆上提供了研讨会的论文;来自大多数会谈的幻灯片和前几年可以在ISPD网站上获得:http://www.ispd.cc。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号