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High Density Connectors with High Metric Pitch Under the Aspect of High Data Rate Transmission

机译:高数据速率传输下具有高公制间距的高密度连接器

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In today's communication technology transmission of high data rates is a matter of fact. This as such is not considered a big problem. However, the difficulties start with the realization of the electrical and mechanical parameters.The board connector is one of the most critical bottlenecks of today switching system hardware. Therefore the achievable performance of a high pincount connector is evaluated in this paper. This investigation is performed with a prototype hardware of future switching systems. The result demonstrates that the selected SIPAC~® connector is capable for the transmission of up to 128 differential signals with 800 Mbit/s each between boards of one shelf.
机译:在当今的通信技术中,高数据速率的传输是事实。因此,这并不是一个大问题。然而,困难始于电气和机械参数的实现。 板连接器是当今交换系统硬件最关键的瓶颈之一。因此,本文评估了高引脚数连接器的可实现性能。使用将来的交换系统的原型硬件执行此研究。结果表明,所选的SIPAC〜®连接器能够在一个机架的板之间传输多达128个差分信号,每个差分信号的传输速率为800 Mbit / s。

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