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BICMOSG3 Cell - A Novel High-Speed DRAM Cell Taking Full Advantage of BICMOS Technology

机译:BICMOSG 3 单元-充分利用BICMOS技术的新型高速DRAM单元

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The BiCMOSG3 cell, a novel high density memory cell using BiCMOS technology is described. The cell is based on merging four transistors and occupies approximately the area of a single MOS transistor. The implementation of three gain mechanisms and a bipolar output driver transistor into the cell ensures both a very high operation speed and a bit line read out signal of about 1 volt using only operation voltages between 0 and 5 volts. The BiCMOSG3 cell allows a completely selective access to single cells or groups of them. Therefore, the recharging of unselected bit lines is not necessary and the power dissipation of an array based on BiCMOSG3 cells is reduced compared to one-transistor cells.
机译:描述了BiCMOSG 3 单元,一种使用BiCMOS技术的新型高密度存储单元。该单元基于合并四个晶体管,并大致占据单个MOS晶体管的面积。三个增益机制和双极性输出驱动器晶体管在单元中的实现,确保了非常高的工作速度以及仅使用0至5伏之间的工作电压即可读出大约1伏的位线信号。 BiCMOSG 3 单元允许完全选择性地访问单个单元或单元组。因此,未选择的位线不需要再充电,与单晶体管单元相比,基于BiCMOSG 3 单元的阵列的功耗得以降低。

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