AlSi/Ti/AlSi Multisandwich Systems on TiN/Ti for VLSI Interconnect Applications

摘要

The influence of the Ti thickness of the AlSi/Ti/AlSi system on Ti/TiN was investigated by transmission electron microscopy (TEM), x-ray diffraction measurements, scanning electron microscopy (SEM) and energy dispersive x-ray analysis (EDX). The results are discussed and correlated to the data of accelerated electromigration stress tests.