Modelling of the Thermal Debinding Behavior of Copper MIM Parts Using Thermo-kinetic Analysis

摘要

The thermal debinding behavior of a metal injection molded (MIM) copper part was investigated at four different heating rates using a Netzsch TG 449 F1 Jupiter Thermo-Nanobalance. The results were evaluated through Model free kinetic analysis. By using the calculated kinetic parameters such as pre-exponent factors and kinetic energies, a non-linear regression model was established. The prediction was made for the behavior under rate controlled mass loss (RCM) condition. The resulting temperature profiles were compared with the results of rate controlled mass loss (RCM) experimental runs. The agreement between the experimental data and the thermokinetic data under rate controlled mass loss (RCM) was found to be very satisfactory.