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COMPARISON OF IONIC CONTAMINATION TEST METHODS TO DETERMINE THEIR ABILITY TO RELIABLY PREDICT PERFORMANCE RISKS

机译:离子污染试验方法的比较确定其可靠预测性能风险的能力

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In the Electronic Manufacturing Services Industry, one of the known failure mechanisms is caused by the presence of ionic contamination. Ionic contamination leads to electrochemical migration and dendritic growth. Through the years, there have been various methods employed to verify the ionic cleanliness of electronic components, printed circuit boards and their assemblies. The accepted industry standard test is Surface Insulation Resistance, SIR, testing. Although this is recognized as the test of merit, it can take weeks to prepare the test vehicles, run the test and analyze the results. By the time this is complete, the product has shipped. If failures are found in test, it is too late to be of practical use. The industry is looking for a test which can be run quickly and is representative of the product currently in production so that decisions, and potential corrective actions can be implemented prior to shipping product to customers. One alternative method is Resistivity of Solvent Extract, ROSE, testing. This method is primarily aimed at product which has gone through a cleaning process just prior to the test. However, in printed circuit board assemblies, PCBAs, there has been a shift from water wash fluxes followed by cleaning, to a process that utilizes no-clean flux with no cleaning. If ROSE testing is used in conjunction with no-clean flux, it often will lead to false fails, because no-clean fluxes are known to contain ionic residues. Another more recent test is the Critical Cleanliness Control, C3, test, which is designed to test specific regions on a PCBA that may be prone to ionic contamination related failures. In this paper, a direct comparison will be made between ROSE testing, SIR testing and C3 testing. The test results will be augmented by a detailed visual inspection, Ion Chromatography, IC, testing, and other tests, as required.
机译:在电子制造服务业中,其中一种已知的失效机制是由离子污染的存在引起的。离子污染导致电化学迁移和树枝状生长。多年来,已经采用了各种方法来验证电子元件,印刷电路板及其组件的离子清洁度。接受的行业标准试验是表面绝缘电阻,先生,测试。虽然这被认为是值得的测试,但它可能需要数周才能准备测试车辆,运行测试并分析结果。到这一点完成时,产品已发货。如果在测试中发现了失败,则为实际使用为时已晚。该行业正在寻找一个可以快速运行的测试,并且代表目前在生产中的产品,以便在将产品运送到客户之前实现决策和潜在的纠正措施。一种替代方法是溶剂提取物的电阻率,玫瑰,测试。该方法主要针对在测试之前通过清洁过程的产品。然而,在印刷电路板组件中,PCBAS,已经从水洗助焊剂随后进行了清洁的过程,以利用没有清洁的无清洁通量的过程。如果玫瑰测试与无清洁的助焊剂一起使用,它通常会导致假失败,因为已知无清洁的助熔剂含有离子残留物。另一个最近的测试是临界清洁度控制,C3,测试,旨在测试可能易于离子污染相关失败的PCBA上的特定区域。本文将在升级测试,先生试验和C3测试之间进行直接比较。根据需要,通过详细的视觉检查,离子色谱,IC,测试和其他测试来增强测试结果。

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