The Chip on Glass method, one of the mounting technologies for driver IC of glass Liquid Crystal Displays, requires conductive particles as an intermediate material having elasticity and deformability to achieve good electric connections. In the case of Chip on Plastics for the plastic film Liquid Crystal Displays, the plastic substrate it ·self has appropriate elasticity and deformability. Therefore, good electric connections could be obtained by heating to cure the Non Conductive Paste material and pressing IC chip having metal core bump electrode. As the result of evaluation, lower resistance was observed in the method of using Non Conductive Paste compared with the method of Anisotropic Conductive Film having conductive particles.
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