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The development of semiconducting fiberglass tapes LSP-O, their properties, and their use for anti-corona protection of high voltage windings

机译:半导体玻璃纤维的开发胶带LSP-O,它们的性能及其用于高压绕组的防电源保护

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Semiconducting fiberglass tapes were developed in order to achieve a stable, heat-resistant, chemically homogeneous semiconducting material with electrical resistance, which would be independent of the probability of the distribution of semiconducting fillers (such as carbon-black or SiC) in the dielectric binders, and in order to avoid the influence on the material resistance of the binder thickening degree during manufacture of the winding and the aging in operation.
机译:开发半导体玻璃纤维带以实现具有电阻的稳定,耐热的化学均匀半导体材料,其与介电粘合剂中半导体填料(如炭黑或SiC)分布的概率无关并且为了避免在绕组制造过程中对粘合剂增稠程度的材料抗性的影响和操作中的老化。

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