In this paper, a novel method is developed to reconstruct the physically structures of a nonuniform couple transmission lines from layer peeling algorithm and genetic algorithm. Base on the time domain reflection (TDR) measurement, the impedance profile of the device under test (D.U.T) is first derived by layer peeling transmission line synthesis. Then, the genetic algorithm (G.A.) is employed to extract the parameter of the lumped/distributed circuits in high-speed digital circuit. As a result, the system characteristic can be easily obtained by the extracted model and SPICE circuit simulation software.
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