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A method for characterizing electrical stability of organic coatings in microelectronic applications

机译:一种特征微电子应用中有机涂层电稳定性的方法

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With the surface test vehicle structure used for the experiments described in this report, significant changes in potential over device surfaces have been measured at distances of 10 to 40 mils from the driving electrodes. This potential propagation has been studied for cases involving moisture sensitivity and instabilities at high temperatures due to organic conformal coatings. Several factors should be kept in mind in applying the reported results to commercial types of integrated circuits. First, the 40 V bias used to induce drift in the test structures is considerably higher than normally used in integrated circuits. All other things being equal, the rate of surface potential drift should scale with the drift bias. A second factor involves distance from the driving electrode. All results given in this report are for an electrode-toprobe FET separation of 10 mils unless noted otherwise. On the basis of the simplified Shockley model of surface instability one would expect the rate of surface potential change to be inversely proportional to the square of the electrode to probe spacing. In integrated circuits the small separation of biased leads and active regions might be expected to aggravate surface ion drift effects. On the other hand, proximity of other interconnects near ground potential might act to limit surface potential changes to acceptable values.
机译:利用用于本报告中描述的实验的表面试验车辆结构,在从驱动电极10至40密耳的距离下测量了在装置表面上的潜力的显着变化。已经研究了涉及由于有机保形涂层的高温下湿度灵敏度和稳定性的情况进行了这种潜在的繁殖。在将据报道的结果应用于商业类型的集成电路时,应牢记几个因素。首先,用于诱导测试结构中漂移的40V偏差显着高于集成电路中的通常用于通常使用。所有其他情况相同,表面电位漂移的速率应该与漂移偏差缩放。第二因子涉及与驱动电极的距离。本报告中给出的所有结果都是用于10密耳的电极 - 盆脚孔FET分离,除非另有说明。基于简化的表面不稳定模型,可以预期表面电位变化的速率与电极的正方形成反比,以探测间隔。在集成电路中,可以预期偏置引线和有源区的小分离来加剧表面离子漂移效果。另一方面,接近地电位附近的其他互连的接近可能采用以限制对可接受的值的表面电位变化。

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