Effects of humidity and heat aging on a new one-component silicone resin encapsulant

摘要

During the past year, a new one-part silicone resin encapsulant has been developed, characterized by a long pot life coupled with quick curing when heat is applied. "Open tank" pot life is about three months, and a shelf life of nine months or more at room temperature in storage. Curing times range from 30 minutes at 150°C to 240 minutes at 100°C, for sections i inch in thickness. These curing characteristics were developed to fill specific needs for an encapsulant which could be used in high volume, automated electronic packaging operations.