New Hybrid Large DIPIPMTM for PV Application with built-in SiC-SBD and seventh-generation CSTBT~?

摘要

A new transfer mold type hybrid Silicon Carbide (SiC) large DIPIPM~(TM) developed for photovoltaic (PV) power generating application is presented in this paper. The new DIPIPM~(TM) is designed with built-in SiC Schottky Barrier Diode (SBD) and seventh-generation CSTBT~(TM) chip that helped to achieve about 25% power loss reduction compare with Mitsubishi Electric’s existing PV DIPIPM~(TM).