Extended Lifetime of a new IGBT Module for Traction Applications

摘要

A new standard power semiconductor module with extended lifetime for traction applications is presented. Using next level technologies like sinter die attach and an improved wire bonding, the power cycle capability can be increased by a factor of 2 to 3 compared to conventional package technologies for traction. Not only the overall product lifetime is extended but also the robustness under overload conditions is greatly increased, leading to lower life cycle cost and higher power density.