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Extremely Low-voltage and High-speed Operation Bulk Thyristor-SRAM/DRAM (BT-RAM) Cell with Triple Selective Epitaxy Layers (TEL)

机译:具有三层选择性外延层(TEL)的极低电压和高速操作的大容量晶闸管SRAM / DRAM(BT-RAM)单元

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We have successfully developed an alternative SRAM cell for the first time using a bulk thyristor-RAM (BT-RAM) with triple selective epitaxy layers (TEL) for anode, n-base, and cathode. The n-base of the pnp transistor is a key for the thyristor characteristics. We optimized both the thickness and the dopant concentration of the n-base by using an in-situ doped selective epitaxy technique. We obtained high current gain (脽 values) for the pnp transistor in a thyristor, and the TEL BT-RAM cell was thus able to read/write at 200 ps at 0.6 V. It also showed good retention characteristics even at 125 掳C and the possibility of good scalability for a gate length of 45 nm and beyond. The TEL BT-RAM cell is therefore a promising alternative SRAM and DRAM cell for the future generations.
机译:我们首次使用带有三重选择性外延层(Tel)的散装晶闸管-RAM(BT-RAM)成功开发了替代SRAM单元的替代SRAM单元(TEL),用于阳极,N基底座和阴极。 PNP晶体管的N基底是晶闸管特性的钥匙。我们通过使用原位掺杂选择性外延技术优化了N基碱的厚度和掺杂剂浓度。我们获得了晶闸管中PNP晶体管的高电流增益(脽值),并且TEL BT-RAM电池因此能够在0.6V下读/写入/写入。它也表现出良好的保留特性,即使在125℃和125℃下也显示出良好的保留特性栅极长度为45nm及以后的良好可扩展性的可能性。因此,Tel BT-RAM电池是未来几代人的有希望的替代SRAM和DRAM单元。

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