Experimental and analytical study of EMC/EMI effects on PCBs and cables enclosed within metallic structures

摘要

This work presents an experimental study of EMC/EMI effects on cables and printed circuit boards enclosed within a complex structure comprising several cavities. To this end, a multi-cavity structure was constructed, with several measurement ports to evaluate EMI coupling under various enclosure configurations. Specifically, the measurement setup employs multiple rectangular and cylindrical cavities, penetrating wires and printed circuit boards. The structure was illuminated by a plane wave and the induced fields and load voltages were measured over a 1-3 GHz band. An integrated hybrid solver based on previously validated tools was used and continues to be developed for analyzing the EMI/EMC problem at the system level.