Manufacturability and reliability of different size wirebonds on different Al pad structures

摘要

The manufacturability and reliability of wirebonds depends on many factors, most of which are linked to the BEOL wafer fabrication process. This paper presents a detailed experimental analysis of the effect of pad thickness and liner levels on the quality of the interconnection. Varying ball sizes are evaluated and compared for different target pitch applications. Thermal aging of the wirebonds with subsequent wire pull and ball shear was studied and the challenges of this test are described.