The effects of swizzling on inductive and capacitive coupling for wide signal busses

摘要

Recent advances in Deep Submicron Design (DSM) have considerably increased the importance of inductive coupling effects for long interconnects. This is especially significant for global interconnect with its wide busses that may run from one corner of a chip to the other. Inductive coupling has been shown to depend on the distance wires run in parallel to each other and the activity on these wires. It has also been shown that the presence of signal wires separating the attacker and the victim leads to a reduction in the inductive coupling between the two. A technique known as swizzling has been proposed to make use of this fact to control inductive coupling in wide global signal busses. In this paper we show that this technique reduces the inductive coupling for the most vulnerable wires neighboring the attacker in significantly long busses by around 20% without negatively impacting the capacitive coupling.