Design considerations for single package radio/spl trade/ (SPR) solution for EGSM/DCS dual band cellular phones

摘要

A fully integrated front end radio on SPR, that provides a hybrid SOC and SIP solution, is presented. The SPR includes DCR transceiver, PA, directional coupler detector and FEM implemented on different die technologies plus discrete SAW, LPF, and diplexer in addition to embedded and discrete SMT components. The module is implemented on a low cost 4-layer MCM laminate substrate and its size is equal to 13/spl times/13/spl times/1.8 mm. The area saving on PCB phone boards by using the SPR is about 1/4 the discrete solution implementation. Results show that the complete radio integration can be successfully integrated on SPR.